Electronics Design Reliability Testing and Software. Learn about Sherlock Automated Design Analysis and more. Now part of ANSYS, Inc.
Joined June 2015
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2 May 2019
DfR Solutions, the developer of Sherlock, the industry's only automated design reliability analysis software, and a leading provider of reliability and quality services, is now part of ANSYS, the global leader of engineering simulation software. bit.ly/2JgH5z4
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3 May 2019
Is standards-based testing lithium-ion batteries sufficient to guarantee battery safety and reliability? DfR explains how you can test high manufacturing quality and ensure the reliability of batteries in your applications ow.ly/ueg650sn7kh
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3 May 2019
Join CEO Dr. Craig Hillman in Boston next month at the MD&M BIOMEDevice Conference to learn the fundamentals of designing a reliable embedded device and the most common pitfalls encountered by the system designer ow.ly/siZi50sk5Oq
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2 May 2019
Uncover the key infant mortality and wear-out failure modes for fixed wavelength transceivers ow.ly/ylyt50sndme
2 May 2019
Semiconductor manufacturers must account for differences in how automotive OEMs and their suppliers qualify integrated circuits compared to consumer products. Discover how BLR testing plays a critical role in the process ow.ly/TKac50slXAH
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Welcome to ANSYS, @DfRSolutions!
#ANSYS Acquires Assets Of Electronics Automated Design Analysis Leader DfR Solutions: bit.ly/2DKbRx3
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1 May 2019
“Fan manufacturers design products that pass the test. And some fans are very good at passing these tests. So, what’s the problem? Fans keep failing.” The current testing of fans is insufficient, DfR proposes a solution ow.ly/fUrz50sn0WL
1 May 2019
Join our live webinar tomorrow hosted by Nathan Blattau! Learn what package types are the most susceptible thermal cycling fatigue and explore which factors to consider when designing a thermal cycling robust electronic product ow.ly/eh5P50qMRzO
30 Apr 2019
Discover how using a Physics of Failure approach throughout the design process ensures product reliability and, ultimately, enhances speed to market #DfRInsight ow.ly/A8Sj50sn0lb
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30 Apr 2019
The Sherlock 6.1 Locked IP Model is changing the way OEMs, systems integrators and suppliers communicate and how their designs travel ow.ly/jWGy50slXzj
29 Apr 2019
Sherlock 6.1 can generate a full-scale detailed model of PCBs and run them through thermo-mechanical analysis in a matter of minutes. Learn more about how the latest version of Sherlock is transforming the automotive environment ow.ly/Az8p50slXyc
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26 Apr 2019
Our design review process provides designers across various industries with a blueprint for navigating the dichotomy between protecting intellectual property and ensuring the reliability of a product via a reliability consultant ow.ly/jMWE50qMTDo
25 Apr 2019
Using Physics of Failure techniques, you can evaluate the impact of environmental stresses to determine failure mechanisms and predict product lifespan under actual operating conditions ow.ly/TQqq50qU6wU
25 Apr 2019
Our next live webinar with Nathan Blattau is one week from today! Learn what package types are the most susceptible thermal cycling fatigue and explore which factors to consider when designing a thermal cycling robust electronic product ow.ly/1jRc50qMRzi
24 Apr 2019
An increasing number of companies are noticing that the classic solder fatigue calculation models do not seem to capture all the possible risks of failure. What are the most common models to calculate risk of failure and what are they missing? ow.ly/kau450qU5Wl
24 Apr 2019
Semiconductor manufacturers must account for differences in how automotive OEMs and their suppliers qualify integrated circuits compared to consumer products. Discover how BLR testing plays a critical role in the process ow.ly/EFrL50qMSs5
23 Apr 2019
For decades, the electronics industry depended on gold for wire bonding. Copper wire offers a plentiful, low-cost alternative to gold, but the transition can be difficult. Learn more about copper wire and the role Sherlock can play in its implementation ow.ly/aald50qU5li
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23 Apr 2019
Underfill is used in flip chip applications to reduce thermal stresses solder bumps experience. Careful consideration to the underfill material properties and intended use environments must be made to assess the relative reliability improvements they offer ow.ly/xrBh50qMQN3
22 Apr 2019
Identify different methodologies to reduce risk of procuring counterfeit devices by having the appropriate tests performed ow.ly/GTjv50qU56X