$XFAB Major achievements so far:
• Technology transfer and process industrialization at X-FAB advancing well.
• Key equipment installed and commissioned (e.g., SiN LPCVD furnace in March 2024; 193 nm lithography tool in early 2025).
• IMEC–X-FAB licensing agreement finalized for the SOI platform.
• Demonstrator Run 1 completed for SOI (including micro-transfer printing of active components); initial optical results on passive waveguides were promising (October 2025).
• InP active chiplets (lasers, modulators, detectors) prepared by SMART Photonics.
• Packaging and assembly design kits deployed (Luceda PHIX).
• Multi-Project Wafer (MPW) activities started with external partners in September 2025.
• Customer Engagement Portal (
photonixfab.eu) launched in March 2024 — open for first prototyping, R&D, and low-volume access while industrial processes ramp up.
Next steps (planned for remaining months):
• Design work for final Demonstrator Run 2 starts November 2025.
• PIC fabrication expected early 2026.
• Testing/validation of initial demonstrators targeted by end of 2025.
• Continued refinement of processes toward pilot-line readiness.