Brinc and
@Ripple are proud to launch the Hong Kong Financial Innovation Program (HFIP), a first-of-its-kind accelerator powered by the XRP Ledger, designed to shape the future of finance in Asia.
We're excited to announce the applications for Hong Kong Financial Innovation Program are now open. This program is designed for early-stage startups building the future of payments and financial infrastructure.
Whether you're working on cross-border payments, settlement rails, stablecoin infrastructure, or payment-adjacent solutions, we want to hear from you.
What's on offer:
-Mentorship from leading operators and investors
-Introductions to global corporates and institutional partners
-Opportunity to apply for non-dilutive grant funding
We're actively sourcing startups at the pre-seed to Series A stage, with a strong focus on teams building out of Hong Kong and across Asia.
Applications are open now. If you're building the infrastructure that will power global payments, this program was built for you!
Apply via the link below.
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brinc.io/xrpl-program?utm_soโฆ )