New on-demand webinar: @Meta shares how an architecture‑driven planning methodology enables early exploration of 2.5D and 3D designs before netlists or process details exist: bit.ly/4xmo440.
Recognized at PCI-SIG DevCon 2026, Paul Cassidy joins a growing record of Synopsys leadership honored for advancing #PCIe. Read how Synopsys is committed to standards development from specification through interoperability and deployment: bit.ly/4gce8nt
Two advanced 3DIC tape-outs in seven months.
Paul Little of Socionext shares how this milestone highlights fast, efficient multi-die design execution in collaboration with #Synopsysow.ly/qSbB50YGI7M#3DIC#Chiplets
Synopsys and @NVIDIA are building an agentic AI platform for chip design and manufacturing, combining GPUs and autonomous agents to orchestrate workflows across design, verification, and manufacturing. Learn more: bit.ly/43YQGmi
In this episode of EE Times Current, we’ll dive into Physical AI — from humanoids and embodied agents to the chips, sensors, and systems that let machines see, move, and interact with us.
🎙️ Listen now: arw.li/6015B8swPZ#Sponsored by @Synopsys
Scaling AI isn’t just about more compute — it’s about smarter system design. If you're designing the next generation of AI infrastructure, our new eBook has the blueprint you're looking for. Download now: bit.ly/4v2mSRV
As Artemis missions push us farther into space, success depends on mastering complexity across thousands of interconnected components.
This is where innovation in design, verification, and simulation becomes critical. Explore more: bit.ly/4xhfOlE
Our President and CEO, @SassineGhazi, will be participating in a fireside chat next Tuesday at 8:15 am PT.
Register to join the webcast: bit.ly/4ers2kg
A new kind of factory is emerging — one that produces intelligence instead of goods.
Explore how Synopsys is helping enable the design and optimization of AI systems from the ground up: bit.ly/4fJTDP5
Last week, Broadcom joined UCLA, GlobalFoundries, Meta, and Synopsys to launch the Semiconductor Hub at @UCLAengineering. The Hub will advance semiconductor research, workforce development, and AI-powered chip technologies.
Learn more: brcm.tech/4u90TYg
ALT A group of eight people stand on stage in front of a large screen displaying "Semiconductor Hub Launch" with the date May 21, 2026. Behind them is a banner listing partners including UCLA Samueli School of Engineering, Broadcom, GlobalFoundries, IBM, Meta, and Synopsys.
ALT Photo of a crowd clapping
ALT Three individuals are seated on a stage, engaged in a panel discussion. The person on the left holds up a small electronic component. The person in the center shows a colorful diagram. The background features a screen displaying names and affiliations, including Broadcom and UCLA Samueli.
ALT Henry Samueli stands at a podium with a microphone, speaking to an audience. The podium features a sign that reads "UCLA Samueli School of Engineering." The background includes a large screen displaying abstract blue graphics.
How do teams achieve reliable signoff in complex 3D multi die designs? In this Synopsys On-Demand Webinar, @intel shares how its disaggregated client and server designs have driven the evolution of robust 3DIC construction & signoff methodologies: bit.ly/4a65za0
Join us for the 2026 #Chiplets event on June 23-24 to learn more about how chiplets are being implemented today and how the industry is overcoming the real engineering challenges of scaling multi-die designs.
Register now: arw.li/6012B8ZLrA@Synopsys
#NVIDIAGTC Taipei News:
NVIDIA introduced NemoClaw, OpenShell and Nemotron models to help enterprises build AI coworkers.
@Cadence, @Dassault3DS, @Siemens and @Synopsys are using NVIDIA NemoClaw to create autonomous AI engineers that can compress weeks of simulation and verification work into hours.
Welcome Jesse Cohn to Synopsys' Board of Directors. Jesse is a Managing Partner at @Elliottinvmgmt with a long record of success as a director of public technology companies.
Read the full announcement: bit.ly/4dV4SRR
This past May, Synopsys Armenia signed a Letter of Intent with the @EU_Commission to jointly explore cooperation in microelectronics training chip design talent development across the European Union. 🤝
Together, we’re investing in skills, knowledge, and a shared future.
📰Our new LinkedIn #Newsletter is live, bringing you the biggest moments from May. This month showcases how we’re helping customers tackle increasing complexity and scale what’s possible.
Read, share and subscribe! 👇linkedin.com/pulse/may-highl…
In 2021, Synopsys engineers made a prediction in the highly technical area of high-NA #EUV technology. Today, their prediction is proving correct.
Learn why lithography simulation is a strategic enabler for chip development: bit.ly/4vnviTL