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Joined February 2011
4,240 Photos and videos
Secure your complimentary I LOVE DAC registration today Hear from industry thought leaders in Keynote Sessions, SKYTalks, TechTalks and Panels. Visit with leading and emerging companies in AI, Design, EDA, Systems and Software, IP... Register by July 12th. ow.ly/QOUS50YWNH8
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One of the most thought-provoking discussions at CadenceLIVE centered on a challenge that sits at the heart of modern system innovation—how do we ensure that what works perfectly in simulation performs just as reliably in the real world? Read the blog>> ow.ly/Saz350Z1VRI
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At the recent PCI‑SIG Developers Conference US held on May 6-7,2026, Cadence announced the availability of its PCIe Gen8 Verification IP, taking another significant step in enabling early, confident adoption of the PCI Express roadmap... Read the blog>> ow.ly/Bmb150Z1UK8
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Secure Interfaces for Critical Semiconductor Applications Security is now a concern for nearly all semiconductors in nearly all applications. Once of high interest mostly for military and financial systems, both the increasingly... Read the White Paper>> ow.ly/60GH50Z221I
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What is Tee . fail? Scott Best discusses the recent Tee . fail cybersecurity attack that exposes vulnerabilities in Trusted Execution Environments (TEE). Learn what it is, how it works, and how to potentially mitigate this risk. Watch Now>> ow.ly/oUOK50Z1rUA
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Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for real-time perception and autonomy... ow.ly/koKY50YXRll
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LPDDR5/LPDDR4X PHY & Controller IP Core in 12FFC Licensed by Tier-1 U.S. Semiconductor Customer Advanced memory subsystem IP delivered through T2M partner ecosystem ow.ly/52kJ50YYrxB
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Renesas Completes Acquisition of Irida Labs to Expand Vision AI Software Capabilities and Accelerates System-Level Vision Solutions ow.ly/6svB50YXUck
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How Low Can You Go? Pushing the Limits of Transistors Deep Low Voltage Enablement of Embedded Memories and Logic Libraries to Achieve Extreme Low Power Get the Synopsys White Paper ow.ly/C0p550Z9IkF
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Experience CadenceLIVE On-Demand for a focused exploration of where semiconductor design is headed—one shaped by AI-driven workflows, advanced packaging, and system-level complexity. Join keynote sessions and technical tracks and discover how innovation... ow.ly/Bwep50Z0rHK
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Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win ow.ly/8l5E50Z0rVQ
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Keysight Expands Photonics Design Ecosystem with GlobalFoundries PDK Enables engineers to simulate photonic integrated circuits and validate optical link performance in a single environment ow.ly/VOtt50Z94H3
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DisplayPort v1.4 Tx & Rx IP Cores with Industry-Proven up to 8K Support in 12FFC Next-Generation Display Performance for AI, Automotive, AR/VR, HPC, and Consumer Applications ow.ly/AeXn50Z7qRP
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Samsung Electronics Begins Shipment of Industry-First HBM4E Samples ow.ly/ctAS50Z94Mn
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Day 2 at CadenceLIVE Silicon Valley 2026 carried a different kind of momentum. If day 1 established the architectural shift, day 2 made it operational. Across morning and afternoon tracks, the conversation moved decisively from... Read the blog>> ow.ly/5akK50Z1qbk
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SRAM PUF: A Revolutionary Approach to Cryptographic Key Protection Cryptographic keys are the cornerstone of secure digital systems, enabling encryption, authentication, and data integrity. However, securely storing these... Get the Synopsys White Paper>> ow.ly/Q53M50YXUSk
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Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU‑accelerated EDA and SDA flows on Samsung Foundry’s second-generation 2nm node for next-generation AI infrastructure and physical AI designs ow.ly/sntV50Z5pOi
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Keysight Introduces RF Signal Analyzers to Accelerate Wideband Wireless Design and Validation New analyzers help engineers capture more signal behavior with faster measurements, reducing rework and accelerating wireless design and validation ow.ly/ILAb50Z94su
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JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics ow.ly/oNSS50Z94Io
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Meet T2M at MWC Shanghai 24th - 26th June 2026: Showcasing Next-Generation IP Cores ow.ly/58g050Z9FRX
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