Huawei announcement of its new Logical Folding technology. The multi-level collaborative optimization system operates throughout the device, circuit, chip, and system levels. Set to release fall of 2026.
Simply put, Kirin 2026 stacks two wafers face-to-face. Face-to-face means face-to-face, which is F2F (Face-to-Face). In between, hybrid bonding is used to connect the upper and lower layers with ultra-high-density interconnection. The backside of the bottom wafer then uses TSV (Through-Silicon Vias) to continue routing signals, power, and ground outward.