Joined October 2025
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Jun 7
America's semiconductor future is being built right here at home.
Follow @BusinessInsider as they take you inside Intel Oregon—the heart of Intel's R&D network—to see how Intel Foundry is helping advance America's chipmaking leadership through innovation, investment, and manufacturing: ms.spr.ly/6013vexDL
#IntelFoundry #Manufacturing
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Jun 12
Great technology needs great design enablement.
Our collaboration with @Synopsys is helping customers accelerate adoption of Intel 18A and Intel 14A with production-ready PDKs that simplify design, verification, and manufacturing readiness. ms.spr.ly/6014v9mm8
#IntelFoundry #Semiconductors
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Jun 11
Strong semiconductor supply chains are built through investment, innovation, and local ecosystems.
Hear Naga Chandrasekaran's perspective on strengthening manufacturing resiliency in the U.S. in this @BusinessInsider feature.
Watch here: ms.spr.ly/6018v9gme
#IntelFoundry
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Jun 10
We’re deepening our collaboration with @Cadence to accelerate next-gen design on Intel 14A, improving performance and time to market for customers.
Cadence 🤝 @Intel_Foundry are expanding collaboration to accelerate @Intel 14A. Advancing design technology co-optimization (DTCO) with AI-driven design to optimize performance, power & area—enabling faster design for next-gen HPC & mobile.
🔗 ow.ly/A9Cs50Z91Jb
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Jun 10
At this year's #IntelFoundry Supplier Summit, we celebrated the winners of the 2026 Intel EPIC Supplier Award. Thank you for your partnership, innovation, and commitment to excellence as we build the future together.
See the full list of winners: ms.spr.ly/6018vgxn8
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Jun 9
Part of Intel 18A, RibbonFET technology is designed to maximize performance, improve power efficiency, and enhance utilization. Helping power what’s next. ms.spr.ly/6017v5esz
#IntelFoundry #Semiconductors
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Intel 18A debuts in the data center with the new Intel Xeon 6 , brand new handheld gaming chips launching first with Acer and MSI, rackscale AI infrastructure with Foxconn, and Perplexity launches an exclusive hybrid local-and-cloud AI app.
Here are 4 things to know from Intel at Computex 2026.
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Jun 5
Our Leixlip, Ireland campus is where advanced manufacturing, investment in sustainable facilities, and a skilled workforce power Europe’s semiconductor future.
Learn more: ms.spr.ly/6018vdObY
#IntelFoundry #Manufacturing
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Jun 4
From AI to HPC, the next generation of technology relies on continued advances in semiconductors.
In this @USATODAY feature, Intel Foundry leaders and industry analysts discuss the innovations helping drive the industry forward.
Watch now: ms.spr.ly/6015vdMuD
#IntelFoundry #Semiconductors
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Jun 3
From EMIB-T to co-packaged optics and glass substrates, Intel Foundry is advancing the packaging technologies that will power the next generation of AI and HPC systems.
See what we shared at #ECTC2026: ms.spr.ly/6019vb4wl
#IntelFoundry
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Jun 1
Chiplets are driving the next era of AI innovation.
As part of the Accelerator Ecosystem Alliance, the Intel Foundry Chiplet Alliance is helping accelerate interoperable, scalable chiplet ecosystems with open standards and advanced packaging technologies.
Learn more: ms.spr.ly/6011vbThb
#IntelFoundry #Chiplets
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May 29
Intel Foundry’s EMIB technology enables high-bandwidth, power-efficient communication between multiple dies in a single package.
See how: ms.spr.ly/6012vZwJ6
#IntelFoundry #AdvancedPackaging
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May 28
“Advanced packaging has emerged as a critical new lever for performance in the AI era.”
Ravi Mahajan shares insights on the origins of EMIB and how advanced packaging is enabling the next generation of AI systems. ms.spr.ly/6013vZzt7
#IntelFoundry #AdvancedPackaging
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May 27
AI growth depends on smarter, more energy-efficient systems.
Intel researchers and industry collaborators highlight why improved heterogeneous integration roadmaps are critical for the future of AI, advanced packaging, and next-gen computing. ms.spr.ly/6011vktfc
#IntelFoundry #AI
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May 26
Advanced packaging is shaping the future of AI system scaling.
From EMIB and Foveros innovation to scaling advanced packaging in Rio Rancho, the latest @Forbes article highlights why packaging is becoming central to foundry leadership.
Read more: ms.spr.ly/6017vkrkt
#IntelFoundry #AdvancedPackaging
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May 22
As AI accelerators push beyond reticle limits, packaging is becoming a key scaling challenge.
A recent Chipstrat analysis highlights how Intel Foundry’s EMIB architecture can help improve scalability, yield, and cost efficiency for large AI packages.
Read here: ms.spr.ly/6016vVn5A
#IntelFoundry #Semiconductors
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May 21
The latest from @USATODAY explores how Intel Foundry is helping drive the next era of semiconductor innovation, from advanced manufacturing to resilient supply chains.
Take a closer look here: ms.spr.ly/6010vpFsC
#IntelFoundry #Semiconductors
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May 19
Where the world’s most advanced chips are built matters.
The latest from @USATODAY highlights semiconductor innovation, resilient supply chains, and the future of computing.
Featuring insights from Intel Foundry leadership and industry analysts: ms.spr.ly/6016vT744
#IntelFoundry #Semiconductors
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May 13
At ISSCC 2026, Myung-Hee Na, VP of Systems and Technology Research, spoke with students about how engineers are shaping semiconductor innovation in the AI era—and why this field matters now more than ever. ms.spr.ly/6010vuJXC
#IntelFoundry
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May 12
The future isn’t given. It’s built.
From concept to creation, Intel Foundry helps turn vision into reality.
The future is yours for the making. ms.spr.ly/6015vPVYx
#IntelFoundry
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