前例通りならばXR2 Gen3はTSMC N3P、FastConnectは7900でTSMC 6nmでしょう。 アーキテクチャ・製造プロセスを8 Elite Gen 5(仮)と共有。 前作より製造プロセスだと前者は1世代、後者は2世代の向上。

高通的 FastConnect 系列和天玑的 Filogic 系列 瑞昱主要在电脑上出现（虽然我现在的两台笔记本都是Intel网卡，但之前有用过瑞昱的）

$LUMN — The hidden pipes powering the AI economy. Another big opportunity in the physical layer of AI is the fiber moving the data. $LUMN is a name you can buy today around 8.70 that has the potential to generate a 50% return over the next 6-12 months. $AMZN AWS — First mover: Lumen was named the FIRST network provider to collaborate with AWS on AWS Interconnect – last mile. Enterprises can now establish private, high-speed connections to AWS in minutes vs. weeks — across Lumen's 340,000 route miles of metro and last-mile fiber. $Anthropic — Selected to expand their fiber network across all of North America. Purpose-built high-capacity infrastructure to power AI research and model training. Part of Lumen's nearly $13B in total Private Connectivity Fabric (PCF) contracts. $ORCL Oracle — OCI (cloud infrastructure) guided 84% YoY growth last quarter, well above estimates. Lumen is a named Oracle FastConnect partner — the private network on-ramp enterprises use to connect directly to OCI. As Oracle's AI cloud scales, Lumen's pipes carry the traffic. The scorecard: → $13B in PCF contracts (Microsoft, Meta, Google Cloud, Anthropic more) → 47M fiber miles by 2028 | 58M by 2031 → $4.8B debt eliminated via AT&T deal → NaaS customers 29% YoY Why this matters now: Earnings drop May 5. With hyperscaler demand accelerating and PCF backlog building, this could be the quarter that forces the street to re-rate the story.

This week we shipped a update to Canvas Cloud AI that allows on-premise data center (A data center outside of the cloud) to be represented in your diagrams. This example is a on-premise data center connected to a VCN in OCI using FastConnect. Prior to this release we didn't represent on-premise data centers in diagrams. The on-premise data center is represented on the left hand side of the diagram. Have a look and try the same with the other cloud providers, as well. canvascloud.ai/gallery/oci-f…

At MWC 2026, Qualcomm introduced its next generation of wireless connectivity with the FastConnect 8800 and new Dragonwing Wi-Fi 8 platforms. 🔗 Read the full article: zurl.co/YiqFE #WirelessNetworking #WiFi8 #Qualcomm #NetworkEngineering #WiFiTechnology #WirelessIndustry

“FastConnect 8800 is likely to impact the mobile connectivity experience more than any other product released at #MWC26.” World‑first 4x4 and Proximity AI deliver longer range, reliability, and smarter connectivity. Read more from WiFi Now: bit.ly/3PIPr7e

Faster. Smarter. Further. FastConnect 8800 delivers up to two times faster speeds with a breakthrough 4×4 Wi‑Fi architecture—along with longer range and greater reliability for demanding mobile experiences. Read more: bit.ly/48a1hgK

Trouble finding your friend at the cafeteria? Need help summoning your car? With Qualcomm FastConnect 8800, connectivity becomes contextually aware, leveraging proximity AI to sense, locate, and react in real time. See it in action:

So #MWC2026 was crazy last week and some people might have overlooked the @Qualcomm FastConnect 8800 launch. I actually spoke with Chano Gomez from Qualcomm about the new chipset, Wi-Fi 8, 4x4 and the quad-radio capabilities! youtu.be/Zh8ExHGCgZQ

FastConnect 8800 brings Wi-Fi 8, Bluetooth 7.0, UWB, and Thread into a single chip, helping enable seamless, secure, low-power mesh connectivity for smart home and IoT devices. Read more: qualcomm.com/news/releases/2… #ThreadGroup @Qualcomm #OpenThread #BuiltOnThread

[Blog] Qualcomm FastConnect 8800 traerá el Wi-Fi 8 a los smartphones blog.elhacker.net/2026/03/qu…

Qualcomm is already looking ahead to Wi-Fi 8 with the introduction of a robust portfolio to drive next-gen connectivity for the emerging AI era. Key among them is its FastConnect 8800 platform. hothardware.com/news/qualcom…

🚨 BREAKING: Qualcomm Unveils Its First Wi-Fi 8 Chip. Qualcomm has introduced its first Wi-Fi 8-ready connectivity system, the FastConnect 8800, at Mobile World Congress 2026. It's built on a 6 nanometer process, the chip delivers up to ~11.6 Gbps peak speeds and extends gigabit speed range up to 3× farther than previous wireless solutions. The platform uses AI-native networking to dynamically manage traffic, reduce latency and maintain stable connections in crowded environments with many devices. It also integrates Bluetooth 7, Ultra Wideband (UWB), and advanced Multi-Link Operation, enabling devices to connect across multiple bands simultaneously for higher reliability. The FastConnect 8800 will power future smartphones, laptops, XR devices and routers, with the first commercial products expected in late 2026. Qualcomm also confirmed plans to collaborate with industry partners to launch global 6G networks around 2029, aiming to support next generation AI, immersive computing and ultra-connected infrastructure.

@Qualcomm has unveiled a comprehensive Wi-Fi 8 portfolio featuring FastConnect 8800 mobile connectivity, new infrastructure platforms with on-device AI compute, and early partner commitments aimed at accelerating AI-era wireless performance. hubs.ly/Q045mVX90

Next topic here at #MWC26 - we rely so much on Wi-Fi every day. @Qualcomm's new FastConnect 8800 can up to TRIPLE the gigabit range of Wi-Fi connections, bringing real speeds to where you really need it. Very excited to get this into my phone or laptop.

「Wi-Fi 8」＆「Bluetooth 7」に対応した通信チップ「FastConnect 8800」をQualcommが発表、6G通信の2029年開始に向けた取り組みも開始 gigazine.net/news/20260303-q…

💡 Qualcomm lancia il chip FastConnect 8800 con Wi-Fi 8: raggiunge gli 11,6 Gbps, triplica la copertura gigabit e integra Bluetooth 7, UWB e Proximity AI su un unico die a 6 nm. gomoot.com/qualcomm-lancia-i… #news @Qualcomm_IT #tech

🚨 Breaking🚨🌐 Qualcomm unveils FastConnect 8800, first Wi-Fi 8 chip with 11.6 Gbps, boosting next-gen connectivity and paving the way for AI-native 6G networks by 2029.

.@Qualcomm unveils WiFi 8 chips for clients and access points. cnx-software.com/2026/03/03/… At Mobile World Congress 2026, Qualcomm introduced the 12.5 Gbps FastConnect 8800 WiFi 8, Bluetooth 7, 802.15.4, and UWB chip for clients (phones, laptops, robots), and five Dragonwing networking platforms delivering up to 33 Gbps WiFi for enterprise and mainstream access points with 25GbE, Fiber, and/or 5G connectivity.