ALT Principal Project Leaders, Scott Andrews and Dr. Abbasi Gandhi are joined by Senior Project Leader, Vaishali Jagannath Prabhu at the UK plastics conference, where they will be able to discuss a number of innovations in plastics bonding and use across industry. Having recently successfully completed the diffusion bonding of transparent polymers, our experts are keen to speak with companies about the benefits and potential applications of this innovative breakthrough.
ALT This innovative approach, specialised for compact heat exchangers and other applications, showcases the potential to transform heat exchanger challenges. #TWI at @FABTECHExpo 2023
ALT π Exciting News: TWI Ltd Granted Diffusion Bonding Patent! π¬ Invented by TWI group manager Alec Gunner and section manager Nick Ludford, the technique produces an autogenous joint without the requirement of interlayers or melting point suppressants. This innovative technique unlocks possibilities for compact heat exchangers, cooling loops, heat sinks, and more. Discover more: https://lnkd.in/eB6XhSXB Contact us at ContactUs@twi.co.uk to explore new technical and commercial opportunities! π
ALT Our experts Dr Nick Ludford, James Redman and Dr Kostas Georgilas will be presenting on the following topics: - Effects of joint design and interlayers on ceramic-metal joints (21 June) - Development of a novel diffusion bonding technique for Al-alloys (22 June) - Characterisation and performance of a novel high entropy alloy as a braze filler metal for #VacuumBrazing (22 June) - Vacuum brazing of #SuperDuplex stainless steels and corrosion resistance (22 June) This yearβs LΓT conference will be held in Aachen (Germany) on 21-23 June 2022.
ALT We are proud to be presenting a technical webinar on diffusion bonding to The Indian Institute of Welding Mumbai Branch (IIW-India). James Redman and Chris Wiseman will represent TWI Ltd, with James delivering a significant presentation on the state of the art of diffusion bonding, including opportunities and challenges for the technology. The event will take place digitally on 31st October at 4-30pm local time. Discover more: https://bit.ly/34DxFYU #DiffusionBonding #technology #enginnering
