Cerebras did what the industry calls impossible: turned an entire 46,225mm² wafer into one chip. Defects on silicon that big are inevitable, so they built in redundancy and custom per-batch masks that route around every bad core, landing near 100% usable wafers. The results: 900,000 cores and 44GB of SRAM on a single piece of silicon, no packaging, no off-chip hops. And they're not stopping there, now exploring hybrid bonding a DRAM wafer on top for even more fast memory. (1/4) 🧵