Joined April 2021
639 Photos and videos
og. XBC >>>> all the others
ゼノブレイド。 どのシリーズも世界観はいいけど、やっぱ初代の「大昔相打ちになった神様の身体のうえがフィールドです」にはちょっと勝てないよなぁ。
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o fato dessa imagem aqui ser real só me comprova que é divertido demais vasculhar nosso passado
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P3 🧡 What a result for our partner @McLarenF1 at the Barcelona-Catalunya Grand Prix. Proud to back the team!
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The Rio 3.5 model broke the internet this week. The plot twist? It’s essentially our open-source model, Nex N2 Pro, wearing a different hat. 🤯 We analyzed the weights, and the recipe is exact: Rio 3.5 ≈ 0.6 * Nex N2 Pro 0.4 * Qwen 3.5 It even literally introduces itself as "Nex N2 Pro" if you ask it without initial system prompt! 😂 We are flattered that the City of Rio used our work to achieve SOTA performance. Thanks for the ultimate benchmark validation. 🤝 But in the open-source world, attribution matters. 👇 Full mathematical proof & verify script in the first reply!
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RT @jukan05: LMAO, TrendForce just revealed the entire CoPoS supply chain lol.
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The Great Space Corridor
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Batou / バトー 『GHOST IN THE SHELL / 攻殻機動隊』(1995年)
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Jokes aside Square silicon substrates for packaging do exist Mitsubishi Materials has produced 510mm x 510mm square silicon panel substrates in 2024 Now, these are not made by using the Czochralski process, which creates a super-high-purity monocrystalline silicon boule Mitsubishi's columnar silicon is made by casting high-purity silicon and directionally solidifying it, and it is polycrystalline with grain boundaries These are not suitable for transistor production because they are not that pure (7N vs 11N), but they can absolutely be used as substrates for advanced packaging
Stacy has created a new process for creating cuboidal silicon ingots called the Rasgon process It's a huge upgrade over the traditional Czochralski (CZ) process
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Wow, great info!!
LMAO, TrendForce just revealed the entire CoPoS supply chain lol.
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Panel-level packaging isn’t just about shape The panels are also much larger than round wafers, so you get both less edge waste and more total package area per process step PLP is already used in niche applications, but because it is a more complex process, panel-level packaging is still not widespread across the semiconductor supply chain That will change soon, and it could become a true packaging revolution Hence why you should start positioning for it
Explain why panel-level packaging is the future in one picture:
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Why are you standing in the way of progress zeph?
BRUH 🤣🤣🤣🤣🤣 Why the fuck do people think that these are silicon panels?? Go read about panel-level packaging before writing shit like this The big square panel is glass
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Replying to @RYANHINGSHING
has happened But I haven't seen adoption yet x.com/zephyr_z9/status/20661…

Jokes aside Square silicon substrates for packaging do exist Mitsubishi Materials has produced 510mm x 510mm square silicon panel substrates in 2024 Now, these are not made by using the Czochralski process, which creates a super-high-purity monocrystalline silicon boule Mitsubishi's columnar silicon is made by casting high-purity silicon and directionally solidifying it, and it is polycrystalline with grain boundaries These are not suitable for transistor production because they are not that pure (7N vs 11N), but they can absolutely be used as substrates for advanced packaging
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🇧🇷 Modelo de IA aberta treinada no Rio com financiamento público ao longo do último ano pela @Prefeitura_Rio superando todos os outros modelos. Inteligência artificial não é uma coisa distante, estrangeira, de laboratório bilionário…não existe só pra fazer texto, imagens aleatórias. O Rio acaba de disponibilizar um modelo aberto de inteligência artificial. E o que isso significa? Capacidade de analisar mais dados, responder mais rápido, entender problemas complexos sem depender de soluções compradas prontas lá fora. E com a Pref.rio interagir e atender melhor a população usando IA. Significa pra quem ainda tinha alguma dúvida sobre o potencial do “Rio AI City” agora vai precisar olhar pra cá com muita atenção e seriedade. Energia, água em abundância, conectividade, talentos, construção de data centers e visão de futuro. Hoje o mundo está falando de um modelo aberto de IA treinado no Rio. Engenharia brasileira. Soberania. Desenvolvimento tecnológico. Rio no centro do futuro. Parabéns ao time da @Prefeitura_Rio com o IPLAN mostrando ao Brasil que é possível! Obrigado @eduardopaes por ter acreditado e iniciado o desenvolvimento desse projeto no último ano. Seguimos! - 🇧🇷 An open AI model trained in Rio and publicly funded over the last year by @Prefeitura_Rio has just surpassed all other models. Artificial intelligence is not something distant, foreign, or confined to billion-dollar labs. It is not just about generating text or random images. Rio has just made an open artificial intelligence model publicly available. And what does that mean? It means greater capacity to analyze data, respond faster, and understand complex challenges without depending on off-the-shelf solutions developed abroad. It means @Prefeitura_Rio will be able to interact with and serve people better through AI. For anyone who still had doubts about the potential of “Rio AI City,” it’s time to pay close attention. Clean energy, abundant water, connectivity, data center development, talents and a long-term vision for the future. Today, the world is talking about an open AI model trained in Rio. Brazilian engineering. Sovereignty. Technological development. Rio at the center of the future. Congratulations to the entire @Prefeitura_Rio team, especially IPLAN, for showing Brazil that this is possible. And thank you @eduardopaes for believing in and launching this project last year. We keep moving forward. 🇧🇷

Alibaba Qwen3.7 slowly fading into irrelevance at the frontier due to proprietary stance. In it's place we have Minimax M3 and... *checks notes* Rio 3.5 397b, made by the municipal IT company of Rio de Janeiro's city government. huggingface.co/prefeitura-ri…
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All of Cray's early designs went crazy hard
Cray-1 is an early example of a class of computers called "supercomputers." Built by Wisconsin's Cray Research, Inc. it was used by the National Center for Atmospheric Research (NCAR) to model the behavior of the Earth’s atmosphere. This effort required a huge range of complex calculations that only the five-ton Cray-1 could do. The Cray-1's wiring, with its circuits arranged in a three-quarters circle, helped increase the speeds of signals within the computer.
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Also soon it will power AI ⚡️ 🚀
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Haters will say it is AI
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Wait until people realize why wafers are circles and not squares. Betting against TSMC can’t be this easy man.
Explain why panel-level packaging is the future in one picture:
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It has been for over the last 20 f*cking years already....
Sorry Brazil but your team this year is straight trash😭
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